Three-dimensional semiconductor device and manufacturing method thereof

ABSTRACT

Disclosed are a semiconductor device and a manufacturing method thereof. The semiconductor device includes: source select lines, word lines, drain select lines, and a bit line stacked on a substrate in which a first cell string region and a second cell string region are defined; channel layers and memory layers vertically passing through the source select lines, the word lines, and the drain select lines in each of the first cell string region and the second cell string region; and a common source line vertically passing through the source select lines, the word lines, and the drain select lines at centers of the first cell string region and the second cell string region, and extended to a lower side of the source select lines.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority to Korean patent applicationnumber 10-2015-0015472 filed on Jan. 30, 2015, in the KoreanIntellectual Property Office, the entire disclosure of which isincorporated by reference herein.

BACKGROUND

1. Technical Field

The invention relates to a semiconductor device and a manufacturingmethod thereof, and more particularly, to a semiconductor deviceincluding a three-dimensional memory device, and a manufacturing methodthereof.

2. Related Art

A semiconductor device includes a memory device in which data is stored.For example, the memory device includes a memory cell array. The memorycell array includes a plurality of memory blocks, and each of the memoryblocks includes a plurality of cell strings. The cell strings include aplurality of memory cells.

A three-dimensional memory device means a device in which cell stringsare vertically formed on a substrate. For example, the memory cells maybe stacked on the substrate in a vertical direction to form cellstrings, and the cell strings may be formed in a structure shaped like“U” or “I” according to a structure of the cell strings. The cellstrings having the U-shaped structure may include a plurality of memorycells arranged between a bit line and a pipe gate, and a plurality ofmemory cells arranged between a common source line and a pipe gate. Thecell strings having the I-shaped structure may include a plurality ofmemory cells serially connected with each other between a bit line and acommon source line.

SUMMARY

An embodiment of the invention provides a semiconductor device,including first and second cell strings arranged in parallel to eachother. The semiconductor device also includes a bit line electricallycoupled to one side of each of the first and second cell strings. Thesemiconductor device also includes a common source line electricallycoupled to an other side of each of the first and second cell stringsand extended between the first and second cell strings. In an embodimentof the invention provides a semiconductor device, including sourceselect lines, word lines, drain select lines, and a bit line stacked ona substrate in which a first cell string region and a second cell stringregion are defined. The semiconductor device also includes channellayers and memory layers vertically passing through the source selectlines, the word lines, and the drain select lines in each of the firstcell string region and the second cell string region. Further, thesemiconductor device includes a common source line vertically passingthrough the source select lines, the word lines, and the drain selectlines at centers of the first cell string region and the second cellstring region, and extended to a lower side of the source select lines.

In an embodiment of the invention provides a method of manufacturing asemiconductor device, including forming a structure including U-shapedchannel structures vertically passing first insulating layers and firstconductive layers alternately stacked on a substrate, and electricallycoupled with in the substrate, and a slit vertically passing through thefirst insulating layers and the first conductive layers formed at acenter of the U-shaped channel structures. The method also includesforming a first passivation layer on a lateral surface of the slit. Themethod also includes exposing a channel layer of the U-shaped channelstructures through a lower side of the slit. The method also includesfilling the slit, through which the channel layer is exposed, with asecond conductive layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram for describing a semiconductor system;

FIG. 2 is a diagram for describing the semiconductor device included ina semiconductor system;

FIG. 3 is a circuit diagram for describing a memory block included inthe semiconductor device;

FIGS. 4A to 4F are cross-sectional views for describing a method ofmanufacturing a semiconductor device according to an embodiment of theinvention;

FIGS. 5A to 5F are cross-sectional views for describing a method ofmanufacturing a semiconductor device according to an embodiment of theinvention;

FIG. 6 is a block diagram illustrating a solid state drive including thesemiconductor device according to an embodiment of the invention;

FIG. 7 is a block diagram for describing a memory system including thesemiconductor device according to an embodiment of the invention; and

FIG. 8 is a diagram for describing a schematic configuration of acomputing system including the semiconductor device according to anembodiment of the invention.

DETAILED DESCRIPTION

Hereinafter, an embodiment of the invention will be described withreference to the accompanying figures in detail. However, the inventionis not limited to an embodiment disclosed below and may be implementedin various forms and the scope of the invention is not limited to thefollowing embodiments. Rather, an embodiment is provided to moresincerely and fully disclose the invention and to completely transferthe spirit of the invention to those skilled in the art to which theinvention pertains. Further, the scope of the invention should beunderstood by the claims of the invention. The invention has been madein an effort to provide a semiconductor device and a manufacturingmethod thereof, in which a three-dimensional memory device may be easilyformed by forming a common source line in a pipe gate region. Accordingto an embodiment of the invention, it is possible to easily form a cellstring having an “I”-shaped structure sharing a common source line byforming the common source line in a pipe gate region. Further, it ispossible to increase capacitance and improve an electric characteristicby increasing a stack height of a three-dimensional memory device.

Referring to FIG. 1, a diagram for describing a semiconductor system isillustrated.

In FIG. 1, a semiconductor system 1000 includes a semiconductor device1100 storing data and a control device (CON) 1200 controlling thesemiconductor device 1100. For example, the control device 1200 outputsa command signal CMD and an address ADD to the semiconductor device 1100by a command received from the outside. The semiconductor device 1100performs program, read, and erase operations according to the commandsignal CMD and the address ADD. Further, the semiconductor device 1100and the control device 1200 also transceive data DATA.

Referring to FIG. 2, a diagram for describing the semiconductor deviceincluded in a semiconductor system is illustrated.

In FIG. 2, the semiconductor device 1100 includes a memory cell array1101 storing data, a circuit group 1201 performing program, read, anderase operations of the memory cell array 1101, and a control circuit1301 controlling the circuit group 1201.

The memory cell array 1101 includes a plurality of memory blocks, whichare identically configured. Further, the memory blocks include aplurality of cell strings. The cell strings include a plurality ofmemory cells. The memory cells included in the cell strings are formedin a three-dimensional structure in which the memory cells are stackedon a substrate in a vertical direction.

The circuit group 1201 includes a voltage generating circuit 21, a rowdecoder 22, a page buffer 23, a column decoder 24, and an input/outputcircuit 25.

The voltage generating circuit 21 generates various operating voltagesaccording to an operation command signal OP_CMD. The operation commandsignal OP_CMD may include a program command signal, a read commandsignal, and an erase command signal. For example, when a program commandsignal is applied to the voltage generating circuit 21, the voltagegenerating circuit 21 generates voltages with various levels related toa program operation including a program voltage Vpgm. In addition, whena read command signal is applied to the voltage generating circuit 21,the voltage generating circuit 21 generates voltages with various levelsrelated to a read operation including a read voltage Vread. Further,when an erase command signal is applied to the voltage generatingcircuit 21, the voltage generating circuit 21 generates voltages withvarious levels related to an erase operation including an erase voltageVerase.

The row decoder 22 transmits operation voltages to word lines WL, drainselect lines DSL, source select lines SSL, and common source lines CSLelectrically coupled to a memory block selected from among the memoryblocks included in the memory cell array 110 according to a road addressRADD.

The page buffer 23 is electrically coupled with the memory blocksthrough bit lines BL. The page buffer 23 transceives data with aselected memory block during the program, read, or erase operation inresponse to page buffer control signals PBSIGNALS. The page buffer 23also temporarily stores received data.

The column decoder 24 transceives data with the page buffer 23 inresponse to the column address CADD.

The input/output circuit 25 transmits the command signal CMD and theaddress ADD received from the outside to the control circuit 130. Theinput/output circuit 25 transmits the data DATA received from theoutside to the column decoder 24. In addition, the input/output circuit25 also outputs the data DATA received from the column decoder 24 to theoutside or transmits the data DATA received from the column decoder 24to the control circuit 1301.

The control circuit 1301 outputs an operation command signal OP_CMD, arow address RADD, page buffer control signals PBSIGNALS, and a columnaddress CADD for controlling the circuit group 1201 according to thecommand signal CM and the address ADD.

Referring to FIG. 3, a circuit diagram for describing a memory blockincluded in the semiconductor device is described.

In FIG. 3, the memory block may include a plurality of cell strings ST1to ST2. The cell strings 11 includes source select transistors SST,memory cells MC1 to MCn (n is a positive integer), and drain selecttransistors DST serially connected between the common source lines CSLand bit lines BL1 to BLm (m is a positive integer).

Sources of the source select transistors SST are electrically coupled tothe common source lines CSL. In addition, drains of the drain selecttransistors DST are electrically coupled to the bit lines BL1 to BLm.Gates of the source select transistors SST are electrically coupled tothe source select lines SSL. Gates of the memory cells MC1 to MCn areelectrically coupled to word lines WL1 to WLn. Further, gates of thedrain select transistors DST are electrically coupled to the drainselect lines DSL.

The memory blocks are arranged in a three-dimensional structure. Thememory cells MC1 to MCn within the cell strings ST1 and ST2 may have astructure in which the memory cells MC1 to MCn are serially connected inthe vertical direction with respect to planes parallel to an uppersurface of the substrate. In particular, the common source lines CSL arearranged between the cell strings ST1 and ST2, and the cell strings ST1and ST2 are commonly electrically coupled through wires. For example,when it is assumed that “ST1” is a first cell string and “ST2” is asecond cell string, the common source lines CSL are arranged between thefirst cell string ST1 and the second cell string ST2, and are commonlyelectrically coupled through lower wires of the first and second cellstrings ST1 and ST2.

A method of manufacturing a semiconductor device will be described basedon an example of cross-sections of the first cell string ST1 and thesecond cell string ST2 below.

Referring to FIGS. 4A, 4B, 4C, 4D, 4E and 4F, cross-sectional views fordescribing a method of manufacturing a semiconductor device according toan embodiment of the invention are shown.

In FIG. 4A, there is provided U-shaped channel structures 105, 107 and109, and a slit SL. The channel structures 105, 107 and 109 arevertically pass through in a first cell string region R_ST1 and a secondcell string region R_ST2 of first insulating layers 103 and firstconductive layers 111 which are alternately stacked on a substrate 101,and extended through a pipe region R_PC which is between the first cellstring region R_ST1 and the second cell string region R_ST2. The slit SLis vertically pass through the first insulating layers 103 and the firstconductive layers 111 formed at a center of the U-shaped structures 105,107, and 109.

The first insulating layers 103 may be formed of oxide layers. The firstconductive layers 111 may be formed of metal layers such as a tungstenlayer. The U-shaped channel structure 105, 107, and 109 may formed oflayers electrically coupling the first cell string region R_ST1, thepipe region R_PC, and the second cell string region R_ST2. For example,the layers of the U-shaped channel structure 105, 107, and 109 mayinclude a memory layer 105, a channel layer 107, and a second insulatinglayer 109. The memory layer 105 may include an oxide layer, a nitridelayer, and an oxide layer which are sequentially formed. The channellayer 107 may be formed of a conductive layer such as a polysiliconlayer. The second layer 109 may be formed of an oxide layer.

A passivation layer 121 is formed along a surface of the entirestructure provided with the slit SL. The passivation layer 121 may beformed of an insulating layer. The insulating layer for the passivationlayer 121 is formed of a material having different etch selectivity fromthat of the substrate 101 and the U-changed channel structures 105, 107,and 109. Most preferably, the insulating layer for the passivation layer121 is formed of a material having a low etch speed than that of thesubstrate 101 and the U-changed channel structures 105, 107, and 109.

In FIG. 4B, an etch process is performed to expose the second insulatinglayer 109 under the slit SL. The etch process may be performed by ablanket etch. For example, the etch process may be performed until thechannel layer 107 formed at a lower side in the channel layer 107 formedat a center C_PC of the pipe region R_PC (see FIG. 4A) is exposed. Inthis case, the passivation layer 121 is left on a lateral surface of theslit SL so that the first insulating layers 103 and the first conductivelayers 111 are not damaged during the etch process.

In FIG. 4B, an etch process is performed to remove a part of the secondinsulating layer 109 exposed to the lower side of the slit SL. The etchprocess may be performed by a wet etch process. For example, the channellayer 107 formed in the pipe region R_PC is exposed by removing thesecond insulating layer 109 formed in the pipe region R_PC by performingthe wet etch process.

In FIG. 4D, the pipe region R_PC is filled with a second conductivelayer 123. The second conductive layer 123 may be formed of the samematerial as the channel layer 107. For example, the second conductivelayer 123 may be formed of a polysilicon layer. The polysilicon layerfor the second conductive layer 123 may be formed by a selectivedeposition method to fill the pipe region R_PC. The channel layer 107within the pipe region R_PC is exposed through the lower side of theslit SL so that it is possible to form the second conductive layer 123by a selected deposition method using the exposed channel layer 107 as aseed.

In FIG. 4E, the slit SL is filled with a third conductive layer 125. Thethird conductive layer 125 may be formed of a metal layer having lowerresistance than that of the second conductive layer 123. For example,the third conductive layer 125 may be formed of tungsten.

In FIG. 4F, a third insulating layer 127 is formed on an entirestructure in which the third conductive layer 125 is formed. A hole isformed so as to expose the channel layer 107. In addition, a via isformed by filling the hole with a fourth conductive layer 129. Thefourth conductive layer 129 may be formed of a polysilicon layer or atungsten layer. A fifth conductive layer 131, which is in contact withthe fourth conductive layer 129, is formed in an entire structure inwhich the fourth conductive layer 129 is formed. The fifth conductivelayer 131 may be formed of a metal layer. For example, the fifthconductive layer 131 may be formed of a polysilicon layer or a tungstenlayer. The fourth conductive layer 129 may be formed of a material tohave a lower resistance than the third conductive layer 125.

A final structure formed by the aforementioned manufacturing method hasa configuration in which a common source line CSL is formed between thefirst cell string ST1 and the second cell string ST2. In particular, thefifth conductive layer 131 becomes a first bit line BL1. Further, thethird conductive layer 125 and the second conductive layer 123 becomethe common source line CSL. The first conductive layer 111 at thebottommost end among the first conductive layers 111 becomes the sourceselect line SSL. In addition, the first conductive layer 111 at thetopmost end becomes the drain select line DSL. According to thesemiconductor device, the source select line SSL and the drain selectline DSL may be formed of the plurality of first conductive layers 111.The first conductive layers 111 formed between the source select lineSSL and the drain select line DSL become the word lines WL1 to WLn. Thefirst and second cell strings ST1 and ST2 are disposed at both ends ofthe third conductive layer 125 for the common source line CSL. Further,the second conductive layer 123 electrically coupled to lower sides ofthe first and second cell strings ST1 and ST2 becomes the common sourceline CSL together with the third conductive layer 125.

During the operation of the semiconductor device, a source voltagegenerated by the voltage generating circuit 21 (see FIG. 2) istransmitted to the third conductive layer 125 for the common source lineof the selected memory block through the row decoder 22 (see FIG. 2).Further, the source voltage is transmitted to the first and second cellstrings ST1 and ST2 through the second conductive layer 123 which is incontact with the third conductive layer 125.

Referring to FIGS. 5A, 5B, 5C, 5D, 5E and 5F, cross-sectional views fordescribing a method of manufacturing a semiconductor device according toan embodiment of the invention are shown.

In FIG. 5A, there is provided a stack structure including U-shapedchannel structure 205, 207 and 209, and a slit SL. The channel structure205, 207, and 209 are vertically pass through in a first cell stringregion R_ST1 and a second cell string region R_ST2 of first insulatinglayers 203 and first conductive layers 211 which are alternately stackedon a substrate 201, and extended through a pipe region R_PC which isbetween the first cell string region R_ST1 and the second cell stringregion R_ST2. The slit SL is vertically pass through the firstinsulating layers 203 and the first conductive layers 211 formed at acenter of the U-shaped structures 205, 207, and 209.

The first insulating layers 203 may be formed of oxide layers. The firstconductive layers 211 may be formed of metal layers such as tungstenlayers. The U-shaped channel structures 205, 207, and 209 may formed oflayers electrically coupling the first cell string region R_ST1, thepipe region R_PC, and the second cell string region R_ST2. For example,the layers of the U-shaped channel structure 205, 207, and 209 mayinclude a memory layer 205, a channel layer 207, and a second insulatinglayer 209. The memory layer 205 may include an oxide layer, a nitridelayer, and an oxide layer which are sequentially formed. The channellayer 207 may be formed of a conductive layer such as a polysiliconlayer. The second layer 209 may be formed of an oxide layer.

A first passivation layer 221 is formed along a surface of the entirestructure provided with the slit SL. The first passivation layer 221 maybe formed of an oxide layer. The insulating layer for the firstpassivation layer 221 is formed of a material having different etchselectivity from that of the substrate 201 and the U-changed channelstructures 205, 207, and 209. Most preferably, the insulating layer forthe first passivation layer 221 is formed of a material having a lowetch speed than that of the substrate 201 and the U-changed channelstructures 205, 207, and 209.

In FIG. 5B, an etch process is performed to expose a memory layer 205under the slit SL. The etch process may be performed by a blanket etch.For example, the etch process may be performed until the memory layer205 formed at an upper side in the channel layer 205 formed at a centerC_PC of the pipe region R_PC (see FIG. 5A) is exposed. In this case, thefirst passivation layer 221 is left on a lateral surface of the slit SLso that the first insulating layers 203 and the first conductive layers211 are not damaged during the etch process.

The first passivation layer 221 may be partially damaged during the etchof a lower region of the slit SL. Further, when the first passivationlayer 221 is damaged, the first conductive layers 211 may be exposedthrough the slit SL during a subsequent process. To prevent the firstconductive layers 211 from being exposed through the slit SL, a secondpassivation layer formed of the same material as that of the firstpassivation layer 221 may be further formed along a lateral surface ofthe first passivation layer 221. The second passivation layer 222 may beformed by a similar method to the forming method of the firstpassivation layer 221. For example, after forming the second passivationlayer 222 along a surface of the entire structure in which the firstpassivation layer 221 is formed, the second passivation layer 222 formedin the remaining region, except for the second passivation layer 222formed on the lateral surface of the first passivation layer 221 may beremoved by performing the blanket etch process. Accordingly, the memorylayer 205 is exposed to the lower side of the slit SL.

In FIG. 5C, the second insulating layer 209 is exposed by sequentiallyetching the memory layer 205 and the channel layer 207 exposed to thelower side of the slit SL. The etch process for exposing the secondinsulating layer 209 may be performed by a dry etch process. Next, anetch process is performed to remove a part of the second insulatinglayer 209 exposed to the lower side of the slit SL. The etch process maybe performed by a wet etch process. For example, the channel layer 207formed within the pipe region R_PC is exposed by removing the secondinsulating layer 209 formed in the pipe region R_PC by performing thewet etch process. Although not illustrated in the figures, a first maskpattern may be formed on the first insulating layer 203 at the topmostend to prevent the first insulating layer 203 at the topmost end amongthe first insulating layers 203, and then the etch process may beperformed.

In FIG. 5D, the pipe region R_PC is filled with a second conductivelayer 223. The second conductive layer 223 may be formed of the samematerial as the channel layer 207. For example, the second conductivelayer 223 may be formed of a polysilicon layer. The polysilicon layerfor the second conductive layer 223 may be formed by a selectivedeposition method to fill the pipe region R_PC. The channel layer 207within the pipe region R_PC is exposed through the lower side of theslit SL so that it is possible to form the second conductive layer 223by a selected deposition method using the exposed channel layer 207 as aseed.

In FIG. 5E, the slit SL is filled with a third conductive layer 225. Thethird conductive layer 225 may be formed of a metal layer having lowerresistance than that of the second conductive layer 223. For example,the third conductive layer 225 may be formed of tungsten.

In FIG. 5F, a third insulating layer 227 is formed on an entirestructure in which the third conductive layer 125 is formed. A hole isformed to expose the channel layer 207. Further, a via is formed byfilling the hole with a fourth conductive layer 229. The fourthconductive layer 229 may be formed of a polysilicon layer or a tungstenlayer. A fifth conductive layer 229, which is in contact with the fourthconductive layer 229, is formed in an entire structure in which thefourth conductive layer 229 is formed. The fifth conductive layer 231may be formed of a metal layer. For example, the fifth conductive layer231 may be formed of a polysilicon layer or a tungsten layer.

A final structure formed by the aforementioned manufacturing method hasa configuration in which a common source line CSL is formed between thefirst cell string ST1 and the second cell string ST2. In particular, thefifth conductive layer 231 serves as a first bit line BL1. In addition,the third conductive layer 225 and the second conductive layer 223 serveas the common source line CSL. The first conductive layer 211 at thebottommost end among the first conductive layers 211 becomes the sourceselect line SSL. Further, the first conductive layer 211 at the topmostend becomes the drain select line DSL. According to the semiconductordevice, the source select line SSL and the drain select line DSL may beformed of the plurality of first conductive layers 211. The firstconductive layers 211 formed between the source select line SSL and thedrain select line DSL become the word lines WL1 to WLn. The first andsecond cell strings ST1 and ST2 are disposed at both ends of the thirdconductive layer 225 for the common source line CSL. Further, the secondconductive layer 223 electrically coupled to lower sides of the firstand second cell strings ST1 and ST2 becomes the common source line CSLtogether with the third conductive layer 225.

During the operation of the semiconductor device, a source voltagegenerated by the voltage generating circuit 21 (see FIG. 2) istransmitted to the third conductive layer 125 for the common source lineof the selected memory block through the row decoder 22 (see FIG. 2). Inaddition, the source voltage is transmitted to the first and second cellstrings ST1 and ST2 through the second conductive layer 123 which is incontact with the third conductive layer 125.

Referring to FIG. 6, a block diagram for describing a solid state driveincluding the semiconductor memory device according to an embodiment ofthe invention is described.

In FIG. 6, a drive device 2000 includes a host 2100 and a Solid StateDisk (SSD) 2200. The SSD 2200 includes an SSD controller 2210, a buffermemory 2220, and a semiconductor device 1100.

The SSD controller 2210 physically connects the host 2100 and the SSD2200. The SSD controller 2210 provides interface with the SSD 2200 inresponse to a bus format of the host 2100. In particular, the SSDcontroller 2210 decodes a command provided from the host 2100. As aresult of the decoding, the SSD controller 2210 accesses thesemiconductor device 1100. The bus format of the host 2100 may include aUniversal Serial Bus (USB), a Small Computer System Interface (SCSI),PCI process, ATA, Parallel ATA (PATA), Serial ATA (SATA), and SerialAttached SCSI (SCSI).

Program data provided from the host 2100 and data read from thesemiconductor device 1100 is temporarily stored in the buffer memory2220. When data existing in the semiconductor device 1100 is cached whena read request is made from the host 2100, the buffer memory 2200supports a cache function of directly providing the cached data to thehost 2100. In general, a data transmission speed by the bus format (forexample, SATA or SAS) of the host 2100 may be faster than a transmissionspeed of a memory channel. More specifically, when an interface speed ofthe host 2100 is faster than the transmission speed of the memorychannel of the SSD 2200, it is possible to minimize degradation ofperformance generated due to a speed difference by providing the buffermemory 2220 with large capacity. The buffer memory 2220 may be providedas a synchronous DRAM so that the SSD 2200 used as an auxiliary memorydevice with large capacity provides sufficient buffering.

The semiconductor device 1100 is provided as a storage medium of the SSD2200. For example, the semiconductor device 1100 may be provided as anon-volatile memory device having large capacity storage performance asdescribed with reference to FIG. 2, particularly, a NAND-type flashmemory among the non-volatile memory devices.

Referring to FIG. 7, a block diagram for describing a memory systemincluding the semiconductor device according to an embodiment of theinvention is shown.

In FIG. 7, a memory system 3000 according to the invention may include amemory controller 3100 and the semiconductor device 1100.

The semiconductor device 1100 may have a configuration substantially thesame as that of FIG. 2, so that a detailed description of thesemiconductor device 1100 will be omitted accordingly.

A memory controller 3100 may be configured to control the semiconductordevice 1100. The SRAM 3110 may be used as a working memory of a CPU3120. A host interface (Host I/F) 3130 may include a data exchangeprotocol of a host electrically coupled with the memory system 3000. Anerror correction circuit (ECC) 3140 provided in the memory controller3100 may detect and correct an error included in data read from thesemiconductor device 1100. A semiconductor interface (semiconductor I/F)3150 may interface with the semiconductor device 1100. The CPU 3120 mayperform a control operation for data exchange of the memory controller3100. Further, although not illustrated in FIG. 7, the memory system3000 may further include a ROM for storing code data for interfacingwith the host.

The memory system 3000 according to the invention may be applied to acomputer, a portable terminal, a Ultra Mobile PC (UMPC), a work station,a net-book computer, a PDA, a portable computer, a web tablet PC, awireless phone, a mobile phone, a smart phone, a digital camera, adigital audio recorder, a digital audio player, a digital picturerecorder, a digital picture player, a digital video recorder, a digitalvideo player, a device capable of transceiving information in a wirelessenvironment, and one of various devices configuring a home network.

Referring to FIG. 8, a diagram for describing a schematic configurationof a computing system including the semiconductor device according to anembodiment of the invention is described.

In FIG. 8, a computing system 4000 according to the invention includesthe semiconductor device 1100, the memory controller 4100, a modem 4200,a microprocessor 4400, and a user interface 4500 electrically coupled tothe bus 4300. Where the computing system 4000 according to the inventionis a mobile device, a battery 4600 for supplying an operating voltage ofthe computing system 4000 may be further provided. Although it is notillustrated in the figure, the computing system 4000 according to theinvention may further include an application chipset, a Camera ImageProcessor (CIS), a mobile DRAM, and the like.

The semiconductor device 1100 may have a configuration substantially thesame as that of FIG. 2, so that a detailed description of thesemiconductor device 1100 will be omitted as a result.

The memory controller 4100 and the semiconductor device 1100 mayconfigure an SSD.

The semiconductor device and the memory controller according to theinvention may be embedded by using various forms of package. Forexample, the semiconductor device and the memory controller according tothe invention may be embedded by using packages, such as package onpackage (PoP), ball grid arrays (BGAs), chip scale packages (CSPs),plastic leaded chip carrier (PLCC), plastic dual in line package (PDIP),die in waffle pack, die in wafer form, chip on board (COB), ceramic dualin line package (CERDIP), plastic metric quad flat pack (MQFP), thinquad flat pack (TQFP), small outline (SOIC), shrink small outlinepackage (SSOP), thin small outline (TSOP), thin quad flat pack (TQFP),system in package (SIP), multi chip package (MCP), wafer-levelfabricated package (WFP), and wafer-level processed stack package (WSP).

As described above, an embodiment has been disclosed in the figures andthe specification. The specific terms used herein are for purposes ofillustration and do not limit the scope of the invention defined in theclaims. Accordingly, those skilled in the art will appreciate thatvarious modifications and another equivalent example may be made withoutdeparting from the scope and spirit of the invention. Therefore, thesole technical protection scope of the invention will be defined by thetechnical spirit of the accompanying claims.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising: forming a structure including U-shaped channel structuresvertically passing through first insulating layers and first conductivelayers alternately stacked on a substrate, and electrically coupled inthe substrate, and a slit vertically passing through the firstinsulating layers and the first conductive layers formed at a center ofthe U-shaped channel structures; forming a first passivation layer on alateral surface of the slit; exposing a channel layer of the U-shapedchannel structures through a lower side of the slit; and filling theslit, through which the channel layer is exposed, with a secondconductive layer; and performing a wet etch process by exposing thechannel layer formed in a pipe region by removing a third insulatinglayer formed in the pipe region.
 2. The method of claim 1, wherein theforming of the first passivation layer on the lateral surface of theslit includes: forming the first passivation layer along a surface of anentire structure in which the slit is formed; and performing a blanketetch process so that the first passivation layer is left only on thelateral surface of the slit.
 3. The method of claim 1, wherein the firstpassivation layer is formed of a second insulating layer.
 4. The methodof claim 3, wherein the second insulating layer is formed of a materialhaving a lower etch speed than that of the substrate and the U-shapedchannel structures.
 5. The method of claim 1, further comprising:forming a second passivation layer along a lateral surface of the firstpassivation layer before the filling of the slit with the secondconductive layer.
 6. The method of claim 5, wherein the secondpassivation layer is formed of the same material as that of the firstpassivation layer.
 7. The method of claim 3, wherein the U-shapedchannel structures include a memory layer, a channel layer, and a thirdinsulating layer.
 8. The method of claim 1, wherein the first insulatinglayers and the first conductive layers are electrically coupled throughthe pipe region.
 9. The method of claim 1, further comprising:performing an etch process until the channel layer formed at a lowerside at a center of the pipe region is exposed.
 10. The method of claim9, wherein the etch process is performed to remove part of the secondinsulating layer.
 11. The method of claim 1, wherein the secondconductive layer is formed of a polysilicon layer to fill the piperegion.
 12. The method of claim 1, wherein the second conductive layeris formed using the exposed channel layer as a seed.
 13. A method ofmanufacturing a semiconductor device, comprising: forming a structureincluding U-shaped channel structures vertically passing through firstinsulating layers and first conductive layers alternately stacked on asubstrate, and electrically coupled in the substrate, and a slitvertically passing through the first insulating layers and the firstconductive layers formed at a center of the U-shaped channel structures;forming a first passivation layer on a lateral surface of the slit;exposing a channel layer of the U-shaped channel structures through alower side of the slit; and filling the slit, through which the channellayer is exposed, with a second conductive layer, wherein the filling ofthe slit, through which the channel layer is exposed, with the secondconductive layer includes: forming a third conductive layer at the lowerside of the slit through which the channel layer is exposed; and fillingthe slit, in which the third conductive layer is formed, with a fourthconductive layer.
 14. The method of claim 13, wherein the fourthconductive layer is formed of a material having lower resistance thanthe third conductive layer.
 15. The method of claim 14, furthercomprising: forming a fifth conductive to be in contact with the fourthconductive layer.
 16. A method of manufacturing a semiconductor device,comprising: forming a structure including U-shaped channel structuresvertically passing through first insulating layers and first conductivelayers alternately stacked on a substrate, and electrically coupledthrough a pipe region in the substrate, and a slit vertically passingthrough the first insulating layers and the first conductive layersformed at a center of the U-shaped channel structures, wherein theU-shaped channel structures include a memory layer, a channel layer, anda third insulating layer; forming a first passivation layer on a lateralsurface of the slit; exposing the channel layer formed at the piperegion through a lower side of the slit; filling the pipe region with asecond conductive layer for a common source line; and filling the slitwith a third conductive layer for the common source line, wherein thesecond conductive layer is formed using the exposed channel layer formedat the pipe region as a seed.